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| ⒐Feature |
→ Connector、Sensor、ECU内部电子部品检查用设备
→ 高倍率放大提高画像清晰度
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| ⒐Specification |
→ 100kv,100.(0.1mA)
→ 55 micron focus(sealed
type)
→ magnification Max.600x
→ P.C控制 & Joystick控制
→ ZET1-XT安装各种测定功能及 2D,3D,Histogram,Table自动位置决定等功能
→ Table X-Y-Z-Axis&
Camera Z-Axis,Manipulator
→ Table tilting(Xθ-Yθ45?)为
Option |
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| ⒐Feature |
→ 强透过率、超微焦点实现高倍率检查
→ ECU 表面贴装基板 Soldering状态,Power
TR,半导体Wire状态等检查
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| ⒐Specification |
→ 150kv,500.(0.5mA)
→ 5 micron focus(sealed
type)
→ magnification Max.500x
→ P.C控制 & Joystick控制
→ ZET1-XT安装各种测定功能及2D,3D,Histogram,Table自动位置决定等功能
→ Table X-Y-Z-Axis&
Camera Z-Axis,Manipulator
→ Table tilting(Xθ45.)(Xθ-Yθ45.)为
Option |
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| ⒐Feature |
→ 1 micron设备最大放大倍率1800x
→ 高倍率实现对精密部品分析,检查,表面贴装基板 Soldering状态的检查
→ Open Tube与 Filament交替型
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| ⒐Specification |
→ 160kv,200.(0.2mA)
→ 1 micron focus(Open Tube-Filament交替型)
→ magnification Max.1800x
→ P.C控制 & Joystick控制
→ ZET1-XT安装各种测定功能及2D,3D,Histogram,Table自动位置决定等功能
→ Table X-Y-Z-Axis&
Camera Z-Axis,Manipulator
→ Table tilting(Xθ45.)(Xθ-Yθ45.)为
Option |
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